Smarter, Cheaper Way to Shape Semiconductor Surfaces

Researchers have found a new way to shape semiconductor surfaces. They used a simple cracking method on GaAs substrates. This avoids expensive photolithography and etching steps. The method creates tiny, precise V-shaped grooves. The key is a thin layer of nickel. By changing its thickness, they control the size and shape of the grooves. This includes the distance between grooves, their depth, and angle. They also used computer models to understand how the material breaks. This helps explain the groove shapes. The grooves affect how light reflects off the surface. The angle of the grooves matters most. The distance between them has less impact. The surfaces also show different wetting properties. This means water or other liquids behave differently on them. The bigger the grooves, the more pronounced this effect. This new method is a big step forward. It's cheaper and simpler than old techniques. It could be useful in many areas. These include optoelectronics and technologies that deal with wetting.